Technologies
Optimized & Industry-ready Solutions
For All Your Complicated Needs
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Our Innovations
LDI (Laser Direct Imaging) laser exposure
As a leader in optical technology, Omni Semiconductor Advanced Packaging (OSAP) Lab has worked closely with:
- Shangyi Co. Ltd.
- Wittech Co. Ltd.
- Dongjie Technology Co. Ltd.
in the field of LDI to develop high-performance laser exposure technology to improve the manufacturing quality of PCBs, IC substrates and high-end electronic components. UV exposure light source technology is in cooperation with Japan Light Source Technology Co., Ltd. from Hsinchu to provide high-stability and high-energy density light sources to ensure that image resolution and process stability meet industry-leading standards.
Omni Semiconductor Advanced Packaging (OSAP) Lab continue to promote the upgrade of LDI technology, improve production accuracy and efficiency through AI intelligent optimization, machine learning algorithms and automated correction technology. Our LDI system not only significantly reduce manufacturing costs, but also be applied to flexible electronics, microelectronics and precision optoelectronic processes to expand more high-value-added application scenarios.
AOI vision inspection
As an optical laboratory, Omni Semiconductor Advanced Packaging (OSAP) Lab also demonstrates exceptional capabilities in visual metrology. We collaborate with JM Vision and A*STAR (Agency for Science, Technology, and Research) to develop precision visual metrology technologies, focusing on substrate drilling metrology and CT tomography. These technologies provide efficient inspection solutions for PCBs, advanced semiconductor packaging, and high-precision components.
Our visual metrology systems combine AI-powered recognition, automatic defect detection, and deep learning algorithms to automatically analyze, identify, and classify anomalies, providing real-time corrective actions to effectively improve production yield and product reliability. Furthermore, our 3D metrology technology enables micron-level precision inspection, ensuring quality assurance across various high-precision manufacturing industries.
Electrical test
The stability and reliability of electronic equipment directly impact market competitiveness, making high-performance electrical testing technology indispensable. Omni Semiconductor Advanced Packaging (OSAP) Lab specializes in high-current DC testing technology, employing FPGAs for high-speed and precise testing. Working with a professional technical team, we develop high-performance test systems to ensure the accuracy and stability of test results.
In addition, our electrical testing systems utilize relational database technology to intelligently analyze test data, predict anomalies, and assess quality trends, helping customers further optimize product design and manufacturing processes. With the rapid development of emerging technologies such as 5G, electric vehicles, and AIoT (Artificial Intelligence of Things), the demand for high-power and high-frequency testing will continue to increase. Omni Semiconductor Advanced Packaging (OSAP) Lab will continue to invest in R&D to expand high-current, high-frequency, and high-precision testing technologies, providing leading-edge testing solutions for the global electronics manufacturing industry.
Roller Chain Drives
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Inductive / Capacitive Sensors
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Motors & Gear Motors
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Conveyor Chains
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